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In view of the increased scope, advanced packaging is probably a more appropriate terminology than simply electronic packaging Over the past decade or two, semiconductor technology has evolved to the point where packaging cannot be considered as an afterthought in device design and manufacturing The package plays an increasingly more integral, sometimes decisive role in the performance of the semiconductor device or devices it contains The International Technology Roadmap for Semiconductors (ITRS) addresses this fact,5 stating the following in its assembly and packaging section: There is an increased awareness in the industry that assembly and packaging is becoming a differentiator in product development Package design and fabrication are increasingly important to system applications It is no longer just a means of protecting the integrated circuit (IC), but also a way for the systems designer to ensure form fit and function for today s product spanning consumer products to high-end workstations.

Although the definition of high-density packaging varies across the interconnect pitch to a package that has to be codesigned with the chip, it is understood that high-density packaging is and will continue to be a requirement for high-performance ICs and systems5 Figure 41 shows the evolution of what have been termed advanced packaging technologies for the past few years in terms of systemlevel packaging efficiency It is anticipated that system-on-a-chip (SOC) and system-on-a-package (SOP) technologies will dominate advanced packaging for the next several years..

1980s

1990s

Consider spherical polar coordinates, where r 2 sin2 d 2 . Calculate the Ricci rotation coef cients. 1.

2000s

A new requirement on packages that of lead-free solder has initiated a tremendous amount of developmental effort in the past few years. This effort stems from the requirement of packages exported to the European Union (EU) market, to pass Restriction of Hazardous Substances (RoHS) compliance requirements set forth in the Directive 2002/95/EC of the

1. Which technique is not an effective way to begin your presentation (a) Mention the last speaker. (b) Refer to a historical event. (c) Ask a question. (d) Apologize for starting late. 2. How does referring to a previous speaker in uence the audience (a) It reminds the audience of something foolish that the previous speaker said. (b) It noti es the audience that your topic is more important than the previous one. (c) It reminds audience members of something important that they need to remember. (d) It reminds the people in your audience that the day is coming to a close and they should pay attention. 3. The introduction for a one-hour talk should be approximately how long (a) Ten minutes (b) Two minutes (c) Less than six minutes (d) It depends!

European Parliament.6 Origins of the RoHS requirements stem from the need to restrict the use of specific materials found in electrical and electronic products due to their hazardous nature, the risk posed to the environment, their ability to pollute landfills, and the risk posed during its use in component manufacturing and recycling. The substances banned under RoHS requirements and its maximum allowable trace values are as follows:

Lead: 0.1 percent by weight (1,000 ppm) Cadmium: 0.01 percent by weight (100 ppm) Mercury: 0.1 percent by weight (1,000 ppm) Hexavalent chromium: 0.1 percent by weight (1,000 ppm) Polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE): 0.1 percent by weight (1,000 ppm) combined

Two other related but different terms sometimes used in this context are the lead-free and green RoHS is clearly more than lead-free, but green includes absence of antimony (Sb) and halogens (chlorine, bromine, and iodine) However, the eutectic tin-lead solder (Sn63% Pb37%, or SnPb for short) cannot be used in any of the preceding This single requirement is bringing about a paradigm shift to the world of advanced packaging The SnPb solder has been in use in the electronics and related industry for about three decades now During this time, the entire infrastructure related to package manufacture beginning from the assembly materials such as substrates, flux, and underfill, and in case of flip-chip, wafer bumping equipment such as substrate bake and solder reflow ovens and the package reliability requirements such as the JEDEC standards have been centered around the SnPb solder.