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Sep 16, 2015 · The most common 1D barcodes are Code 39, Code 128, UPC-A, UPC-E, EAN-8, EAN-13, etc. 2D barcodes include DataMatrix, PDF 417 and QR codes. In order to create a barcode, you have to install a barcode font onto your system and then use that font in any program that supports fonts like Word, WordPad, etc.

FIGURE 29.15 One hundred mil board with 13 mil diameter hole plated with Copper Gleam PPR for 60 min. Surfaceto-hole ratio is 0.75.

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To have day-to-day control and achieve ductile, strong deposits, and uniform copper thickness, you need the following controls: 1. Maintain equipment following best practices, such as uniform air agitation or e-ductors (also known as ser-ducters ) in the tank, equal anode/cathode distances, rectifier connection on both ends of tank, and low resistance between rack and cathode. 2. Maintain narrow-range control of all chemical constituents, including organic additives and contaminants. 3. Conduct batch carbon treatment as needed. 4. Control temperature at 70 to 85 F, or as specified by supplier. 5. Eliminate contaminants in the tank from preplate cleaners, microetchants, and impure chemicals. The plating thickness distribution of your plating bath can be readily evaluated. Use noncopper-clad or bare epoxy laminate. First, plate 80 to 100 min of electroless copper, then rack the panels and plate at the specified ASF to plate 80 to 100 min of plated copper (usually 1/10 of the plating cycle time). Place the rack in a microetch solution until 60 to 80 percent of the copper is etched away. Remove and examine. The remaining copper is where the highcurrent density is. This is a useful tool in optimizing bath geometry, especially anode placement and panel placement on the rack. It is also useful in designing thieving and shielding for the best thickness distribution. The plated-copper thickness distribution for a specific pattern can also be studied the same way.After plating the electroless copper on non-copper-clad bare laminate, image the pattern. Plate for a limited time to get approximately 80 to 100 min, or 0.2 to 0.3 mm. Strip the resist off the panel and place in microetch until 80 percent of all copper is removed. The remaining copper is where the high-current density is.

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UPC-A Barcode Add-In for Microsoft Word. Generate, insert linear and 2D barcodes for Microsoft Word. Download Word Barcode Generator Free Evaluation.

The preferred industrial process uses an acid copper sulfate solution containing copper sulfate, sulfuric acid, chloride ion, and organic additives.

Solution Makeup by Current Density Using the proper additives, the resultant copper is fine-grained with tensile strengths of 50,000 lb/in.2 (345 MPa), a minimum of 10 percent elongation, and a 1.2 surface-to-hole thickness ratio (see Table 29.4).

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