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Aspect Ratios Aspect ratios are calculated by dividing panel thickness by the hole size. (See Fig. 29.1 for example of a high-aspect hole with a 15:1 ratio.) Standard direct current (DC) plating bath formulations are not sufficient to plate these geometries. Modifying the concentrations of the electrolyte components is required. In general, lowering the copper concentration and increasing the acid concentration improves through-hole distribution, as indicated in Table 29.3. Proprietary additives play a role maximizing through-hole distribution as well. Solution agitation is an integral part of successfully plating high-aspect ratio through holes. Ninety degree work rod agitation with a 1/2 in. stroke is the most common method of replenishing

solution in the holes. Other adjuncts such as high-flow circulation pumps or e-ductor systems aid in solution turnover and replenishment of solution inside the holes.A decrease in corresponding current density is required to achieve improved throwing power and to prevent copper burning. For aspect ratios above 10:1, pulse plating yields the best microdistribution.

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TABLE 29.3 Plating Solutions for Different Aspect Ratios High aspect ratio formulation Aspect ratio Copper sulfate (CuSO4 5H2O) Free sulfuric acid 66 Be electronic grade Chloride ion (Cl ) >8:1 45 g/l 300 g/l 50 ppm Medium aspect ratio formulation 3:1 8:1 60 g/l 260 g/l 50 ppm Low aspect ratio formulation <3:1 75 g/l 225 g/l 50 ppm

Blind Microvia Plating Smaller holes and increasing circuit density are drivers that push technology for via-in-pad and stacked microvia designs that help minimize PWB real estate. It has been established that via-in-pad designs, where the via is not filled, can lead to voids in the BGA solder joint that can negatively affect reliability. Stacked vias, or the sequential build-up process, is a technology where vias (either blind or through hole) are metallized, plated to required thickness, then circuitized. Another layer of dielectric is applied and the process repeated. Electrodeposited copper (see Fig. 29.2) has become an effective method of filling microvias, replacing the alternative via filling techniques, especially as the conductor patterns become finer and the pitch density of the component packaging increases. Resin or conductive pastes have been used for via filling, but the reliability problems associated with these materials include subsequent polishing, entrapped air within the blind micro via, and void formation during the reflow process. All major suppliers to the PWB industry have FIGURE 29.2 Example of a plated filled blind developed processes for filling blind microvias. microvia.

The electrolyte compositions for via filling baths typically run with high concentrations of copper (up to 50 g/l as metal) and lower concentrations of acid (approximately 100 g/l). These concentrations are juxtaposed to high-aspect ratio plating. Thus, these process usually are utilized in a panel plating mode for filling vias only. This type of process usually requires some type of planarization step post-filling to decrease the amount of copper plated on the surface. Proprietary additives are key for consistent filling and for filling vias of various diameters and depths. Typical systems will contain carriers, brighteners, and levelers. Further developed processes are capable of plating through holes and filling vias simultaneously, although aspect ratio capability is limited and should be tested before committing to production.

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