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2 Negative-Acting Liquid Photoresist Removal Negative-acting, liquid-applied photoresist can be readily removed from printed boards that have not been baked excessively Baking is critical to removal because it relates to the degree of polymerization Since overbaking is also damaging to the insulating substrates, processes should stress minimal baking only enough to withstand the operations involved The negative-acting resists are removed by using solvents and commercial strippers In this case, the resist may not dissolve; instead, it softens and swells, breaking the adhesive bond to the substrate Once that has taken place over the entire coated area, a water spray is used to flush away the film 34323 Positive-Acting Photoresist Removal Positive-acting photoresists are removed in commercial organic and inorganic strippers if baking has not been excessive Removal by exposure to UV light and subsequent dipping in sodium hydroxide, TSP, or other strong alkaline solutions is also effective.

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Overbaking makes removal difficult Machine stripping is done in a solution of 05N sodium hydroxide, nonionic surfactants, and defoamers..

34.3.3 Tin and Tin/Lead Resist Removal In SMOBC processing, the metal-plated resist is removed to present a flat, clean copper surface for solder mask definition. Tin/lead alloys can be stripped in oxidizing fluoride solutions such as fluoboric acid and hydrogen peroxide or ammonium bifluoride with hydrogen peroxide or nitric acid. (Caution: machine construction must be made compatible with fluorides by elimination of titanium and glass components.) Commercial formulations are available to be used inline after the etch machine rinses. Accumulations of spent solution or filtered leadfluoride deposits must be treated as hazardous waste and have been accepted by solution vendors for treatment and disposal costs. Modern applications usually use lead-free tin plating resists, which can be fluoride containing as previously discussed, or compounds of ferric chloride

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followed by nitric acid. In either case, feed-and-bleed solution management with filtration and periodic chamber cleanout has been successful.

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This section is a survey of the technology and chemistry of the copper etching systems in common use. Selection of practically available etchants has been limited by economic, operational, and (environmental) regulatory concerns. Fabricators have been forced into practical trade-off decisions to suit situations. Two etchants in particular, chromic sulfuric acid and ammonium persulfate, are no longer practical considerations due to environmental pressures. Other formulations and choices have been modified to suit these pressures. There are two basic etchant needs to be met. The first is traditional foil etching for print and etch, plate/tent and etch, and pattern plate and etch. Virtually all processes in the United States and Europe use constant-rate systems for alkaline ammonia or cupric chloride etchants for this purpose. The second need is developing technology for specific precision very-fineline etching including foil thinning and thin metallization clearout for HDI constructions and fine features. (See Sec. 34.7 for additional discussion and mention of additional chemistries that may be useful for these applications.) Continuous constant-rate systems with process automation represent current practice in production etching. These systems feature feed and bleed of replenishment chemicals under control of process instrumentation that monitors and responds to real-time changes in properties of the working solution. The bleed stream of the working composition etchant is usually returned to suppliers for copper reclamation and chemical recycle. The resulting degree of constant etching rate allows for stable and repeatable performance to achieve practical manufacturing processes. However, as demands for higher precision increase, further sophistication in controls will be necessary. Key factors for selecting an etching chemistry include:

Board design requirements High yield Compatibility with resist Etch rate (speed) Equipment required for process control of etch rate, regeneration, and replenishment Ease of equipment maintenance By-products disposal and pollution control Operator and environmental protection

The preceding factors serve to evaluate copper etchants to be used. Introduction, chemistry, properties, and problems are given in this section, along with suggestions for selection and control.

Alkaline Ammonia Alkaline etching with ammonium hydroxide complexing is increasingly used because of its continuous operation, compatibility with most metallic and organic resists, high capacity for dissolved copper, and fast etch rates. Continuous (open-loop) spray machine chemical control systems are universally used. This operation provides constant etch rates, high work output, ease of control and replenishment, and improved pollution control. However, rinsing after

etching is critical, and the ammonium ion introduced to the rinses presents a waste-treatment problem. On-site closed-loop regeneration with chemical recycling is commercially available but not routinely practiced because of facility requirements, capital cost, fluctuating economics depending on copper commodity pricing, and worker requirements. The general economical and environmentally appropriate operating strategy is to recycle the by-product etchant products under contract to a supplier who reclaims or reconstitutes the copper contained and regenerates the ammoniacal constituents into a reformulated replenisher solution for return to fabricators. 34.4.1.1 Chemistry. The main chemical constituents function as follows:

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