rdlc data matrix

rdlc data matrix

rdlc data matrix

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Plated Etch Resists At present, the most extensive use of metal-plated resists is found in the production of double-sided and multilayer plated-through-hole circuit boards The most commonly used resists are tin (matte and bright surface) Solder plate (60 percent Sn, 40 percent Pb) continues to be used on some reflow-treated solderable coating situations, but it is not favored for a sacrificial resist that is to be removed for SMOBC processing Nickel, tin/nickel, and gold are occasionally used Silver is used to some extent for light-emitting and liquid crystal applications Details concerning the deposition of these metals are given in Chap 29 The use of these resists is described in the following paragraphs 34251 Tin Plating Thin tin deposits (00002 in) are used to make SMOBC boards where the tin etch resist is stripped after etching Alkaline ammonia etchants are usually favored.

Don t write out full sentences on your cards. Use key words to focus on the points you want to make. Key words allow you to sound fresh and natural as you make your way through the presentation. There are, of course, a few exceptions: Write out quotes to ensure accuracy. Write out statistics as well as the statements you ll use to rephrase the numbers to make them more easily understood. Write out any speci c details that must be given verbatim. Use a script when dealing with highly sensitive information. When there is no room for misinterpretation, read from the script. Write out the rst few words of introductions and conclusions to assure a smooth start and nish.

Other etchants, such as sulfuric acid hydrogen peroxide and ammonium persulfate phosphoric acid, have been especially formulated for bright tin Tin plating (directly over barrier layers of nickel or tin/nickel) has been used because of its optimum solderability Cupric and ferric chloride etchants attack tin and are not used 34252 Solder Plate Tin/lead solder (00003 to 0001 in thick) is the plated etch resist for fusing into a solderable finish The 60Sn/40Pb alloy offers good etchant resistance with few problems but must be treated with a brightening solution to retain solderability Increased reliability may be achieved by the use of solder plate over tin/nickel1 Thin solder deposits (00002 in) can be used for the SMOBC process but have no benefit over tin plating for this purpose The most suitable etchants are alkaline ammonia and sulfuric acid hydrogen peroxide.

Ferric and cupric chloride acid etchants cannot be used because of solder plate attack Postetch neutralization rinses are needed, especially with alkaline systems, to rinse away etchant residues and to maintain optimum surface properties 34253 Tin/Nickel and Nickel Tin/nickel alloy (65 percent Sn, 35 percent Ni) and nickel plate, used as is or overplated with gold, solder, or tin, are also capable metal resists for etching copper in alkaline ammonia, sulfuric acid hydrogen peroxide, and persulfates 34254 Gold With an underplate of nickel or tin/nickel, gold provides excellent resistance to all the common copper etchants Some etchants have a slight dissolving effect on gold 34255 Precious Metals and Alloys Rhodium has been described as being a suitable resist for edge connectors on boards; however, the plating process is difficult to control.

When plated over nickel, rhodium tends to be thin and porous and to lift during etching Because of varying surface properties, 18-karat alloy gold and nickel/palladium must be evaluated carefully when used as substitutes for pure gold systems..

34256 Silver Although silver is not used on most printed boards (MIL-STD-275 states that it shall not be used), it has found some applications for camera, light-emitting, and liquid crystal devices Copper etching using silver as resist can be done with alkaline ammonia solutions Silver loss is about 00001 in/mm 34257 Etching Procedures for Plated-Metal Resists Etching of the metal-resist-plated boards begins with removal of the plating resist using commercial strippers The stripping process must be sufficient to remove resist trapped under plating edges Gold, solder, and tin resists must be handled carefully because they scratch very easily Tin/nickel alloy and nickel plate, however, are very hard and resistant to abrasion The procedure after etching includes thorough water rinsing and acid neutralizing to ensure removal of etchant residue on the board surface and under the traces.