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Non-Imageable Early solder masks could not be photoimaged that is, placed in its exact location with a photographic process. They could not be hardened selectively in one area and then be removed from other areas. These masks had to be applied in the final pattern desired, typically through a patterned screen. The silk screening process (the screens are actually nylon) is limited in that it can neither resolve the fine features nor meet the registration requirements and tolerances needed for today s PCB designs. The use of these materials is limited to lower technology products.

Imageable Higher-density circuitry, with its close tolerances and image reproduction requirements, has mandated the use of photoimageable solder mask. Assemblers need fine dams (or webs ) of

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solder mask between fine-pitch component leads (see Fig. 33.1) to enable assembly with low defect rates. These webs are frequently as narrow as 0.003 in. and can be as narrow as 0.001 in. A photoimageable mask is required to meet these needs. Photoimageable masks are available in either liquid or dry-film forms. Liquids account for more than 98 percent of the products used, due to their lower cost, greater availability, ease of use, and acceptability in assembly processing. Dry-film masks require special application equipment, are expensive, are often not robust when used as a resist for final finishes such as ENIG or immersion tin, and are too thick for use in some assembly processes. 33.3.3 Temporary A number of temporary masks are used in PCB fabrication and assembly processing. The properties of these masks vary considerably depending upon the purpose for which they have been used. The typical application for these masks is to protect circuitry from plating and/or soldering. Various products can be removed mechanically by peeling ( peelable mask ) or by dissolving in cleaning chemistry. Since they do not become a permanent part of the finished assembly, there are no industry standards for these products. PCB fabricators and assemblers should be careful to verify the compatibility of any temporary mask with their solder mask(s) to avoid problems such as swelling, blistering, and so on.

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Availability and Consistency There are ongoing changes in the makeup of the supplier base of electronic materials, including solder mask. Many acquisitions have taken place and several products eliminated in the recent past, so users must have confidence that they will have a continued source of supply of solder mask that is the same lot to lot for the future. International Organization for Standardization (ISO) qualification for the manufacturing operation as well as for environmental considerations are good indicators of a supplier with a long-term view.

Performance Specifications 33.4.2.1 IPC-SM-840. This is the predominant solder mask material specification used globally. Most manufacturers test their products to verify that their products are capable of

meeting the requirements of this document The SM-840 includes physical, chemical, thermal, and electrical requirements for two classes of application 33422 Underwriters Laboratories UL94 This specification defines the degree of flammability of a material Solder mask suppliers generally test their products for flammability according to UL94 The solder mask is applied to a specific type of base material or construction before burn testing The main variables in this test are the specific base material and construction, the mask type, and the thickness of each Since most solder mask has no flame retardant, thinner mask and thicker base material will give better results 33423 Telcordia GR-78-CORE This specification, from Telcordia, is commonly referred to by its previous name, BellCore With the introduction of the C Revision to IPCSM-840, the Class T requirements were accepted by the BellCore as equivalent to meeting the GR-78-CORE specification.

This specification is still available as part of a package of documents from Telcordia that is quite expensive However, since Telcordia recognizes the IPCSM-840 Class T specification for solder mask, it is typically not necessary to purchase a copy of the GR-78 specification 33424 Military Applications The military specification that applies to solder mask is MIL-P-55110 Since the mid-1990s, the revisions of this document refer to the IPC-SM-840 specification for solder mask requirements 33425 NASA Outgassing Materials that will be used in space applications are tested under extremely high vacuum conditions To be acceptable, they must exhibit a maximum total mass loss (TML) of 10 percent and have a maximum collected volatile condensable material (CVCM) of 010 percent A list of tested products is available from the NASA web site at http://outgassingnasagov.

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