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Misprints For many years, a primary failure mode in PCB assembly was solderpaste misprints. Misprints occur when the solder stencil or screen does not form a close contact or good gasketing with the circuit features. If there is a gap between the stencil and the copper, or if the screen is slightly misregistered, solderpaste squeezes between the features, causing solder bridging and resulting in a lack of solder where the paste deposition was intended. The uneven surface of HASL is a chief cause of paste misprints. Flat surface finishes such as silver, tin, and OSP virtually eliminate solderpaste misprints. If misprints do occur for other reasons such as misalignment, the finish should be able to be cleaned, staged for reprinting, and soldered without any lack in wetting. OSP may be removed during misprint cleaning; the PCBs should be assembled immediately if this occurs.

Shelf-Life, Storage, and Handling Each finish is vulnerable to solderability loss if the PCB is handled or stored in non-ideal environments. OSP, generally given a 6 to 12 month shelf-life, is degraded with time and temperature, as the organic and underlying copper can oxidize. Silver, with a shelf-life of 12 months, is affected by exposure to sulfur and chloride environments that can cause excessive tarnish. Tin, with a shelf-life of 6 to 12 months, forms intermetallics with copper over time and at elevated

You don t want to use something that s funny to you but carries a different emotion to your audience Making a point Especially in technical presentations awash with esoteric facts and gures, using humor to make a point seizes on the esoteric nature of the topic It works like an inside joke, funny only to a select few In the current crop of crime dramas on TV, there are many examples of this as a tension reliever Leaving em laughing When all is said and done, your audience will remember all of your opening, some to none of your main presentation, and all of your departure That s because they re keyed up when you arrive, and they wake up when you leave Using an anecdote or salient one-liner to exit with is a good way to ensure enough applause to get you off the stage.

temperature. ENIG has a shelf-life exceeding 12 months and can withstand most environments, but is sensitive to steam aging and degrades more quickly than other finishes in mixed flowing gas testing. HASL is considered to have virtually unlimited shelf-life. The shelf-life of any PCB, with any surface finish, can quickly degrade if the parts are exposed to contaminating materials. Any contaminant film that prevents flux and solder from coming into intimate contact with the surface finish will result in non-wetting.

Solderjoint Metallurgy The basic function of the circuit board is to act as a mechanical and electrical connection between components of an electrical device Application of solder to a PCB surface results in the formation of an intermetallic compound The metals in the solder and the metals on the PCB participate in the intermetallic formation The intermetallic acts as the physical glue holding the solder to the circuitry The type of intermetallic depends on the type of solder and the type of PCB finish The vast majority of solders used in electronics (SnPb, SnAgCu, SnCu, SnCuNi) is based on tin Most of the time, the tin forms an intermetallic with copper (Cu3Sn and Cu6Sn5) The primary exceptions are ENIG and electrolytic NiAu finishes Soldering to nickel-based finishes results in Ni3Sn4 and NiSn3 intermetallic compounds.

The physical and electrical performance differences between copper and tin intermetallics do influence the design of electronic devices In general, solderjoints formed using intermetallics of nickel are more brittle and lead to earlier failure in physical shock testing HASL begins to form copper-tin intermetallics when the HASL is deposited at the PCB shop When HASL is soldered at the assembly house, the HASL coating liquefies and mixes with the molten solderpaste or wave solder The intermetallic formed at the PCB interface deepens with each thermal excursion HASL intermetallics can reach thicknesses of concern to reliability engineers Intermetallic layers formed using high tin content solders (Pb-free) grow more quickly due to the increased availability of tin and the elevated temperaturesWith the consumption of copper into intermetallics, there is a concern with the thinning of copper, especially at the knee of plated through holes.