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To understand the difference in sign, note that in this case we have since r the force points in the opposite direction. Now, Newton s third law tells us that F1 = F2 ; therefore, we must have m Am m Am G 22 1 = G 12 2 r r

HOT AIR SOLDER LEVEL (HASL OR HAL)

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HASL is the process of immersing a circuit board into molten solder. For the vast majority of HASL applications, the solder alloy is tin-lead. For Pb-free applications, the main alloys include tin-copper, tin-silver-copper, tin-copper-nickel, and tin-copper-nickel-germanium alloys. The thickness and texture of the HASL surface result from the surface tension of molten solder. As such, the thickness varies from 2 to 20 mm or more. HASL boards demonstrate excellent shelflife, solderability protection, and resistance to poor handling, but they do tend to have higher levels of residual ions left over from fluxing. The HASL operation forms an intermetallic with copper circuitry at the PCB shop. This extra thermal step, with the associated loss in copper, is a concern for Pb-free assemblies. Expansion of the PCB substrate at high temperatures can warp and twist the board.The dimensional movement, along with uneven pad flatness and plugged vias, makes assembling dense circuitry (less than 0.5 mm pitch) difficult or impossible. The worldwide decline of HASL is partly due to assembly concerns and partly due to Pb restrictions.

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Fabrication Process HASL can be applied in vertical or horizontal equipment. As a pretreatment, the copper is cleaned, microetched, and fluxed. It is common for the HASL pretreatment steps to be carried out in conveyorized equipment, and then the panel to be transferred to a vertical machine that dips the individual panel into molten solder. As the panel is raised, air knives

blow off excess solder. To handle the very high temperatures of the molten alloy, equipment is manufactured from stainless steel, titanium, and other alloys. Aggressive rinsing is needed to remove flux residues, as the HASL process is potentially much dirtier than other surface finish processes. Surface finishing engineers must be aware of safety concerns, such as exposure to Pb and the possibility of equipment fires. 32.3.2 Advantages and Disadvantages Table 32.2 compares advantages and disadvantages of HASL.

TABLE 32.2 Advantages and Disadvantages of HASL HASL Advantages Inexpensive relative to other finish options Cu/Sn solderjoint Widely available Reworkable HASL disadvantages Not flat Paste misprints Poor fine-pitch assembly Thick intermetallics May contain Pb Thermal damage to board Solder bridging Plugged PTHs

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Failure Modes HASL involves a delicate balance between sufficient solder coverage and excess solder. Inadequate solder results in exposed copper intermetallics and reduced shelf-life. Excess solder (which is more common) forms bridging among fine-pitch features. If the solder is not removed sufficiently from through holes, pin components do not place at automated assembly. A chief failure mode is due to HASL s lack of flatness. At assembly, stencils do not gasket well to the board surface, so paste misprints and skips can be problematic. Assemblers find difficulty stenciling paste on HASL finished PCBs using technology below 0.5 mm pitch. Positioning a HASL board (see Fig. 32.2) in the fixture for stenciling can be challenging if the PCB dimensions changed during HASL thermal steps.

(a) HASL equipment (b) surface scanning electron micrograph (SEM).

32.4 ELECTROLESS NICKEL IMMERSION GOLD (ENIG)

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Chemically, gold is the ideal element for the external coating of PCBs Gold does not form an oxide, so it is virtually unaffected by temperature and storage conditions that might reduce the shelf-life of other finishes In addition, gold dissolves nearly instantaneously into solder, promoting superior wettability Gold is limited, however, in other ways Gold embrittles solderjoints when present in excess of about 3 percent by weight, so gold coatings of 03 mm maximum thicknesses should be used in soldering Gold dissolves very quickly into copper as well To prevent the mixing of gold with copper, and the eventual solderability problems caused by oxidized copper at the PCB surface, a layer of nickel is deposited to separate the metals ENIG does not rely on electrolytic plating with outside power; in practice, nickel is deposited as a phosphorous-reduced electroless nickel 324.

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