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Technology Drivers Each company in the manufacturing supply chain has needs specific to its manufacturing step. The methods used to achieve these goals have evolved with developments in PCB technology. Historically, technicians were able to solder components directly to copper using very active fluxes. When PCBs were first made in large production quantities, chemists devised ways to protect the copper using metal or organic coatings. Electroplated tin-lead became a popular coating as a metallic layer that could be subsequently reflowed. Design changes forced the era of solder mask over bare copper (SMOBC). With SMOBC, reflowed plated tin-lead was no longer possible because the tin-lead liquefies during the soldering process. HASL, the successor to plated tin-lead, became the surface finish of choice worldwide. Increasing PCB circuit density inspired the reemergence of organic coatings, such as new formulation organic solderability preservatives (OSPs) and metallic layers such as electroless nickel/immersion gold (ENIG.) The environmental initiative to eliminate ozone-depleting chemicals led to the next change in surface finish preference. Use of no-clean assembly operations prompted a decline in OSP and an increase in ENIG. Both ENIG and OSP continue to be widely used, but each has its own weakness, allowing for the proliferation of new low-cost, high-functional immersion metal finishes such as immersion silver and immersion tin. 32.1.3.1 Fabrication Requirements. The company producing the bare printed circuit board that is, the PCB fabricator has needs that are specific to that business, as follows:

If you ve opened your presentation with a question, an ideal ending includes an answer that ties the presentation together. A presentation for supervisors of a major company began with the question What do you think employees in America consider the number one thing that motivates them on the job It might end with this conclusion:

Low chemical and process cost Simple operation (low engineering demands) Reworkability Easily measured thickness Conveyorized equipment Electrically testable surface No sensitivity to poor handling Long shelf-life Inexpensive processing equipment and high throughput No attack of soldermask No toxic chemicals (waste should be easily treated) Specification by most original equipment manufacturer (OEM) customers Capability of being selectively coating with electroplated gold

32.1.3.2 Assembly Requirements. The assembly engineers, whether contract Electronics Manufacturing Services (EMS) provider, independent original design manufacturer (ODM), or captive OEM, have requirements that are very different from those of the PCB fabrication customer:

Flat surface for stenciling paste Low contact resistance for in-circuit test (ICT) Tolerance for paste misprint cleaning Long incoming shelf-life (more than one year) Long midassembly shelf-life (more than two weeks) Compatibility with all pastes and fluxes Capability of bonding with Al and/or Au wire

The ability to be visually inspected (prevents solder mask residue non-wetting) Ease of handling Excellent and predictable wettability Fiducial recognition No warp and twist of the PCB Good compliant pin and connector contacts Good Pb-free soldering with no need for nitrogen No solder bridging or plugged holes The original equipment manufacturer has the following

32.1.3.3 OEM Requirements. additional requirements:

Best solderjoint reliability; strong intermetallic No impact on cost of bare board Prevention of defects (black-pad, voiding, whiskers) Corrosion resistance in uncontrolled field environments Usefulness as an electrical test point and EMI shield Functionality as a touchpad/keypad contact Good electrical performance of high-speed signals Adherence to industry-consensus specifications Complete documentation from the chemical supplier Established supply base of installed fabricators Audited fabricators

Surface finishes available in the PCB industry are as follows:

HASL Reflowed tin-lead ENIG OSP Antitarnish and preflux Immersion silver Immersion tin Electroless palladium (Pd) Electrolytic nickel/electrolytic gold Electroless gold Direct immersion gold Solid solder deposit Table 32.1 shows these alternative surface finishes and their typical thicknesses.

TABLE 32.1 Major Surface Finish Options with Typical Thickness PCB surface finish Hot Air Solder Level Organic Solderability Preservative Electroless Nickel/Immersion Gold Immersion Silver Immersion Tin Typical thickness 2 40 mm (80 1600 min) 0.1 0.6 mm (4 24 min) 3 5 mm (120 200 min) 0.05 0.15 mm (2 6 min) 0.1 0.4 mm (4 16 min) 0.6 1.2 mm (24 48 min)

Nickel: Gold:

So, as you ve seen, the thing people want most from their jobs is not what supervisors think they want. People don t say that money or job security leads the list of most desired things. What employees want most is full appreciation for a job well done. Simply treating people with consideration and honestly appreciating what they do are the best motivators of all. When you go back to work tomorrow, give yourself a checkup to determine how well you provide your employees with what they need.

Figure 32.1 shows the estimated usage of these surface finishes, indicating that no single finish will satisfy all needs. These are discussed in the following sections.

FIGURE 32.1 Worldwide surface finish usage estimates by (a) dollar amount and (b) area share of PCBs manufactured.