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Hitachi M-880 Maleimide styryl 3.6 534 730 7.1 46 70 65 0.56/0.3 23/1 100,000 NA Additive pattern 12-mm copper Additive panel NA

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Maintaining uniform thickness on the panel surface in a galvanic plating operation is difficult. As the aspect ratio becomes higher, maintaining uniform thickness on the hole wall is also a problem. Electroless plating offers two distinctively superior features in this respect: 1. Its excellent throwing power for high-aspect-ratio holes (Fig. 31.5) 2. Its ability to deposit copper film of even thickness over the entire circuit panel. These features of fully electroless plating are ideal for the fabrication of high-tech MLBs, as described in Table 31.1. All signal conductors of the MLBs are formed on innerlayers and the outerlayer surfaces provide pads only for through holes and some bonding pads for decoupling capacitors. The process steps of the panel-plate additive method are essentially the same as those of the galvanic panel-plate method:

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FIGURE 31.5 Excellent hole coverage is achieved by fully additive plating. This shows the cross section of a hole with a 27:1 aspect ratio. (Photo courtesy of Hitachi Ltd.)

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3. Catalyze holes. 4. Perform fully electroless copper deposition (panel-plate). 5. Perform dry film tent-and-etch.

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Process Issues Tenting with dry film becomes difficult when annular rings are very small or in some cases when there are no annular rings at all. In such cases, a positive electrodeposition system may be applied to overcome this difficulty. It should be cautioned, however, that there is a limitation to this panel-plate additive approach, even though the thickness of deposited copper film is much more even across the panel. If very fine conductors are to be formed by this method, the conductor cross section becomes intolerably distorted from the ideal rectangular shape as the ratio of the width to the height of the conductor approaches unity, as shown in Fig. 31.6.

FIGURE 31.6 Formation of fineline conductors by etching process results in undesirable, nonrectangular conductor cross section. (Photo courtesy of Ibiden Co., Ltd.)

As in the case of the panel-plate additive method, the partly additive process starts with copper-clad laminate.11 14 The essence of this process is to minimize the problem encountered in etching fineline conductors through thick copper which results from through-hole plating (in the conventional etched foil process, through-hole is plated first), by forming conductors first, prior to through-hole plating.

Process Steps 1. 2. 3. 4. 5. 6. 7. Copper-clad laminate. Perform hole formation. Catalyze hole walls and remove catalyst sites from the surfaces by brushing. Perform image transfer by screen print or dry film tenting. Form conductor pattern by etching and stripping the resist. Apply plating resist over the entire surface, but leaving pads and holes uncovered. Perform electroless copper deposition onto the pads and hole walls.

Process Issues By proper selection of catalysts and etching solutions, the catalyst on the hole walls survives during the etching operation, posing no problem in the subsequent plating step. In step 6, plating resist can be applied by screen printing when the circuit density is not so high. When the density becomes higher, dry film or liquid photoimageable resist can be used. Liquid resist can be applied by open screen coating, roller coating, or curtain coating. In some cases, step 6 can be bypassed when sideways line growth is not a problem (Fig. 31.3). In such a case, the plating speed is reduced by 20 to 30 percent, from the normal speed of 2.0 to 2.5 mm, in order to avoid copper deposition on unwanted areas (bare laminate areas). Conductors must be made narrower than the intended final width at the design stage to compensate for the side growth.

31.5.3 Fine-Pitch Components As the lead pitch of multipin devices becomes narrower than 20 mil (0.5 mm), bridging between adjacent pads during plating can occur even when plating resist is placed between them. As a result, the practitioners of the partly additive process are abandoning this process and converting to the panel-plate additive method based on the experiences they gained from practicing partly additive technology.

Chemical reactions which take place in electroless plating have been treated well in the literature.4,21 However, they are discussed again here because some of the due comments are relevant to the chemistry of electroless plating.

Electroless Plating Solution Chemical Reactions Main ingredients of most electroless plating bath formulations consist of NaOH HCHO CuSO4 EDTA pH adjustment Reducing agent (formaldehyde) Source of copper iron Cheleting agent