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It is believed that the cleaner/conditioner slightly solubilizes the activator, attracting it to the nonconductive surface, and that the vanillin lines up the palladium molecules, and directs them towards the work, hence giving lower electrical resistance and better adhesion to nonconductive surfaces It is also claimed that there is little palladium/tin left on the copper foil, so it is easily soft-etched away in the normal electroplating preplate cycle (See Fig 302) DPS was the first DMT process to suggest an meter as the standard quality assurance (QA) tool 30123 Converting Palladium to Palladium Sulfide Crimson,4 invented by Shipley, employs a conversion step after the activator where palladium is changed to palladium sulfide, which is claimed to be more conductive for subsequent electrolytic copper plating The enhancer stabilizes the conductive film so that it is chemically resistant to imaging steps.

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The stabilizer neutralizes residues from the enhancer, thereby preventing contamination of subsequent steps The microetch selectively removes activator from copper surfaces to achieve optimum copper-to-copper bond and reliable dry film adhesion The process works best in conveyorized horizontal equipment and can be followed by pattern or panel electroplating (See Fig 303) 30124 Process Variations ABC,5 invented in Israel by Holtzman et al, is similar to EE-1 It has been adapted to conveyorized horizontal equipment, but must be followed by a flash electroplating in a proprietary bath DMT falls into four broad categories:.

Cu foil Prepreg Innerlayer Cu foil Core Pd/Sn Catalyst Innerlayer Cu foil Prepreg Cu foil Accelerate with microetch

Cu foil Prepreg Innerlayer Cu foil Core Innerlayer Cu foil Prepreg Cu foil Electrolytic flash plate with plating inhibitor

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FIGURE 30.1 Principle of EE-1 process: (a) conditioning making glass and epoxy surfaces receptive of Pd catalyst sites; (b) palladium catalyst sites; (c) acceleration removes excess tin and microetch removes catalysts from the surface of Cu foil; (d) flush Cu plate coppers enter surface in drilling hole walls.

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Conductron, from LeaRonal, is similar to DPS with the addition of a special cleaner/conditioner and a glass-etch step. It has been adapted to conveyorized horizontal equipment and can be followed by pattern or panel electroplating. Envision DPS, from Enthone-OMI, and Connect, from M & T (now Atotech), are fairly similar to each other, and to DPS, though each has a specific cleaner/conditioner and modified accelerator. No adaptation has been made to horizontal processing. Both processes can be followed by pattern or panel electroplating. Neopact,6 from Atotech, uses a tin-free palladium activator in colloidal form. The subsequent postdip removes the protective organic polymer from the palladium, leaving it exposed and with increased conductivity. It has been adapted to conveyorized horizontal equipment, works well in vertical, and can be followed by pattern or panel electroplating. (See Fig. 30.4.)

Cu foil Prepreg Innerlayer Cu foil Core Pd/Sn Catalyst + Vanillin Innerlayer Cu foil Prepreg Cu foil Carbonate accelerator + metal ions

Cu foil Prepreg Innerlayer Cu foil Core Innerlayer Cu foil Prepreg Cu foil Postprocessing brushing/ chem-cleaning, microetch

Cu foil Prepreg Innerlayer Cu foil Core Innerlayer Cu foil Prepreg Cu foil Lined-up adsorbed Pd/Cu sites

FIGURE 30.2 Principle of the DPS process: (a) conditioning for receptive surface; (b) catalysts adhering to the surface; (c) stronger adhesion; (d) ready to plate.

Carbon/Graphite Systems 30.1.3.1 Carbon Suspensions. Black Hole,7 the second direct metallization technique, was patented by Dr. Carl Minten in 1988 and pioneered by Olin Hunt, who sold their technology to MacDermid in 1991. MacDermid improved the process considerably and called it Black Hole II. Instead of palladium activator, Black Hole II uses carbon suspensions as its conductive medium. Polyelectrolyte conditioned nonconductive surfaces absorb carbon sites, and they line up after heating. To ensure sufficient conductivity, the carbon treatment is performed twice. Residues of carbon sites must be removed from the copper foil surface by a

FIGURE 30.3 Principle of Crimson process: (a) conditioning; (b) colloidal Pd sites adhered to the surface; (c) Pd-sulfide (stronger adhesion of Pd catalysts); (d) microetch to remove Pd from Cu surface for better Cu-Cu adhesion.

microcleaning step. Black Hole II has been well adapted to conveyorized horizontal equipment and can be followed by pattern or panel electroplating. (See Fig. 30.5.) 30.1.3.2 Graphite. Shadow8 is from Electrochemicals (division of LaPorte Industries, UK) and uses graphite as its conductive medium.The process sequence of Shadow is very simple and involves fewer steps than most DMTs. Electrochemicals and one of their fabricators, Eidschun Engineering, made the breakthrough in inexpensive, compact, conveyorized horizontal equipment, and the Shadow process is well adapted to this mode. It can be followed by pattern or panel electroplating.

F1 = m I a1 = m 1 1 F2 = m I a2 = m 2 2 Using the second equation, we solve for the acceleration of mass 2: m I a2 = m 2 2 a2 = m2 mI 2

Cu foil Prepreg Innerlayer Cu foil Core Pd-colloid absorption (conductor) Prepreg Prepreg Core Prepreg

Stripping of protective polymer (postdip)

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