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Through-Hole This class of component is characterized by parts that have wire or formed leads. These leads pass through holes drilled or punched in the PCB and are soldered to lands on the back side or to plating in the holes. This is the original package type used for electronic components. A major benefit of through-hole components is the fact that every component lead passes all the way through the PCB. Because of this, there is automatic access to any PCB layer to make connections. Further, every lead is available on the bottom of the PCB, so test tooling is easy to construct. With the advent of surface-mount components, through-hole is used primarily for connectors and pluggable devices such as microprocessors mounted in PGA packages. Through-hole packages are often preferred for ICs and other components that dissipate large amounts of heat, because of the relative ease with which heat-sinking devices can be fitted to them. In addition, it is much easier to provide a socket for a through-hole device. This eases the task of changing programmable parts and microprocessors when it is necessary to upgrade a system. Caution: Integrated circuits in through-hole packages are becoming difficult to find as they are displaced by surface-mount equivalents and should be avoided in new designs unless a secure supply of components is available for the production life of the design.

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Surface-Mount This package type is the mainstream choice for packaging electronic components of every type, including connectors. Its principle characteristic is that all connections between a component lead and the PCB or substrate is made with a lap joint to a pad on the surface of the PCB. This has both advantages and disadvantages. On the advantage side, since there are no holes piercing the PCB, wiring space on inner layers and on the reverse side is not consumed with component lead holes. Because of this, it is usually possible to wire a PCB in fewer layers than would be true with through-hole parts. Another and larger benefit is the fact that surface-mount components are always smaller than their through-hole equivalent, making it possible to fit more parts in a given area. The main disadvantages of surface-mount components stem from the fact that there are no leads to easily grip with instrumentation probes and that there may not be access to the leads

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Single-sided coating (hand or flat bed) In this application, each side of the panel is fully coated (except for a border on each side) with solder mask, one side at a time. The panel may be tack dried between coating the two sides, or the second side may be coated immediately using a dimple plate to protect the coating on the first side. It is advantageous to coat both sides of the panel before tack drying so that both sides see the same tack-drying cycle. One concern about this technique is the amount of solder mask that is pushed into the holes. Since this is a single-sided process, there is nothing to restrain the amount of mask that gets pushed into the holes, so it may be more difficult to develop all of the mask out of the holes. Double-Sided Coating Vertical double-sided screen printing applies solder mask to both sides of the panel or panels simultaneously. The screening units used are available in various levels of automation, up to fully automated screening units that are integrated with tack drying ovens. Because they apply mask to both sides at the same time, the units put less mask into holes, making it easier to develop mask out of holes a particularly important consideration when working with small holes that must be free of solder mask. Front-to-back squeegee alignment is critical for putting the least amount of solder mask into the holes.

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A key variable in screen printing is the screen mesh. Most applications utilize a noncalendared, nylon mesh material. These products are designated with the number of threads per inch and the diameter of the threads in microns.Typical examples of commonly used mesh counts are 86-120, 83-100, 86-100, 92-100 or 110-80. Supplier literature will provide a theoretical ink volume for each type that can be used to determine the relative difference in coating weight to be applied to the panel. Table 33.1 provides an overview of the screen process key variables and the effect of operating a process at the extreme of that variable. Spray coating accounts for a limited percentage of the solder mask coating. There is renewed interest in spray coating since it can allow more latitude in removing solder mask from holes. As the holes become smaller, some solder masks and processes have difficulty achieving clean holes after development. At the same time, because the solder mask is sprayed at reduced viscosity, the amount of solvent (VOCs) that is exhausted to the environment is significantly higher than for screen printing, the use of spraying may be limited in some localities.

TABLE 33.1 Screening Process Variables and Effect Operating at the Extremes Process variable Mesh Tension Effect of low Mesh sticking to screen Poor quality printing Low coating thickness Skips (areas with no solder mask) Lower circuit coverage Very sharp edge, lower coverage Lower coverage, Less ink in holes Screen sticking to panels Lower coverage, More flow or sagging if too low Effect of high Nonuniform coating across panel Low coverage over circuits Higher coverage Slightly rounded edge, higher coverage Higher coverage, More ink in holes Skips or difficult printing Higher coverage, Bubbles if too high

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