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recover over 95 percent of the EDTA in the solution. Usually, the purity of EDTA thus recovered is higher than that of purchased EDTA. Ninety-eight percent of the solution is recovered as permeate and is used in such processes as rinsing. The concentrate, the other two percent, is high in salt content (Na2SO4 and HCOONa) and may be evaporated to produce a small amount of solid waste or discharged into the ocean, if the plant is located near the ocean and locally approved.6 This chemical bomb-out method can achieve two objectives at once: removal of unwanted impurities and recovery of chemicals. With this system, it is easy to maintain Baume at the desired 9 . 31.6.6 Environmental Issues of Formaldehyde Formaldehyde is considered to be a carcinogen. If exposed to formaldehyde fumes of certain concentration for a long time, it can cause allergy conditions and perhaps cancer, although cancer due to long-time exposure to formaldehyde in the PWB industry has never been reported. With a good exhaust system and scrubbing through water and peroxide solution, formaldehyde can be made quite harmless. It is a matter of economy. EDTA can be treated as previously mentioned. Reducing agents alternative to formaldehyde such as glyoxylic acid27 and hypophosphite (M3PO2)28 have been suggested and tried, but they have not been able to replace formaldehyde as an effective reducing agent at this stage.

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FIGURE 13.8 Tech, 1992.)

where G is Newton s gravitational constant. The force on mass m 2 due to mass m 1 is given by F2 = m 2 1 Since we are working with the radial coordinate only, the gradient can be written as F2 = m 2 1 = m 2

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The range of choices for packaging electronic circuits is quite broad. Some of the parameters that influence the choices are weight, size, cost, speed, ease of manufacture, repairability, and function of the circuit. The more common types are listed as follows with a brief description of their characteristics. Levels of packaging are often used when referring to how electronic circuits are packaged. The first level of packaging is the housing of an individual component. This is usually an encapsulating coating, a molded case, or a cavity-type package such as a pin grid array (PGA). The second level of packaging is the PCB or substrate on which individual components are mounted. Third-level packaging is any additional packaging beyond these two. Most often third-level packaging takes the form of a multichip module (MCM) that has bare components mounted in it which is itself mounted on a PCB along with other components. 13.2.1 Single- and Double-Sided PCBs These PCBs have conductor patterns on one or both sides of a base laminate with or without plated through-holes to interconnect the two sides. These are the workhorses of consumer

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electronics, automotive electronics, and the RF/microwave industry. They are the lowest-cost choice for consumer products. Laminate materials range from resin-impregnated paper for consumer electronics to blends of low-loss Teflon for RF applications.

Multilayer PCBs These PCBs (see Fig. 13.9) have one or more conductor layers (usually power planes) buried inside in addition to having a conductor layer on each outside surface. The inner layers are connected to each other and to the outer layers by plated through-holes or vias. These are the packages of choice for nearly all digital applications ranging from personal computers to supercomputers. Numbers of layers range from 3 to as many as 50 in special applications. Laminate materials are nearly always some type of woven glass cloth impregnated with one of several resin systems. The resin system is chosen to satisfy requirements such as the ability to withstand high temperatures, cost, dielectric constant, or resistance to chemicals.

Discrete-Wire or Multiwire PCBs This class of PCBs is a variation of the multilayer package. A circuit board is constructed by etching a pair of power layers back to back on a laminate substrate. A layer of partially cured, still sticky laminate is bonded to each side of this power plane structure. Discrete wiring is rolled into this sticky adhesive in patterns that will connect leads or serve as access to surfacemount component pads. Once all of the wires have been rolled into place, a second layer of laminate is placed over the wires, followed by copper foil sheets. This sandwich is then laminated, drilled, and processed like any multilayer PCB. The resulting PCB has outer layers and power planes much like any multilayer PCB. The principle difference is that the printed wiring signal layers have been replaced by discrete wiring layers. In some cases of very high wiring density, alternating layers of power planes between wiring layers serve as isolation. Designing a discrete wiring PCB (see Fig. 13.10) involves adding a special discrete-wiring router to a standard PCB design system to generate the files for the machine that rolls the wire into the dielectric. Discrete wiring once provided a faster prototyping alternative to multilayer fabrication. At the present time, both technologies are equally rapid and cost effective during prototyping. However, for modest to high-volume production, multilayer technology is more cost effective than discrete wiring.

Hybrids These circuits are usually single- or double-sided ceramic substrates with a collection of surface-mount active components and screened-on resistors made from metallic pastes. They are most often found in hearing aids and other miniature devices.

Flexible Circuits These circuits are made by laminating copper foil onto a flexible substrate such as Kevlar or Kapton . They can range from a single conductor layer up to several layers. They are most often used to replace a wiring harness with a flat circuit to save weight or space. Often, the flexible circuit will contain active and passive components. Common applications are cameras, printers, disk drives, avionics, and video tape recorders.

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